TLC NAND

SK Hynix today announced that they’ve begun sampling of its first ever PCIe 4.0 enterprise SSDs in the form of the new 96-layer 3D-NAND U.2/U.3 form-factor PE8010 and PE8030 eSSDs, as well as announcing plans to sample the new PE81111 EDSFF E1.L SSDs based on their 128-layer “4D NAND” flash modules later in the year. We had expected the new PE8111 eSSD for some time know as we reported about SK Hynix’s plans to introduce such a product last November. The biggest change here is the company’s use of new 128-layer 3D NAND modules that the company dubs as “4D-NAND” because of a new denser cell structure design and higher per-die I/O speeds. 16TB Enterprise EDSFF E1.L SSD The PE8111 still retains as PCIe 3.0 interface and...

Western Digital Introduces WD Gold Enterprise SSDs

On what would have been the first day of the Open Compute Project's annual Global Summit, Western Digital is bringing out a new line of enterprise SSDs. The WD...

20 by Billy Tallis on 3/4/2020

Samsung Begins Mass Production Of 96L 3D NAND

Samsung has started mass production of their fifth generation of 3D NAND flash memory, which they brand as V-NAND. This new generation bumps the layer count from 64 up...

26 by Billy Tallis on 7/9/2018

Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND

Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...

17 by Anton Shilov on 7/6/2017

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