DRAM
SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. If the company proceeds with the plan, it intends to invest $4 billion in it and construct one of the world's largest advanced packaging facilities. But to accomplish the project, SK hynix expects it will need help from the U.S. government. Acknowledging the report but stopping short of confirming the company's plans, a company spokeswoman told the WSJ that SK hynix "is reviewing its advanced chip packaging investment in the U.S., but hasn’t made a final decision yet." Companies like TSMC and Intel spend billions on advanced packaging facilities, but so far, no company has announced a chip packaging plant worth quite as much as SH hynix's $4...
G.Skill Announces Trident Z DDR4 DIMMs for Kaby Lake CPUs
G.Skill on Wednesday introduced its new high-end DDR4 memory modules tested for compatibility with Intel’s new Core processors featuring the Kaby Lake microarchitecture. The new Trident Z modules come...
1 by Anton Shilov on 1/4/2017SK Hynix to Build a New NAND Fab, Upgrade Existing DRAM Fab
SK Hynix on Thursday announced plans to build a new manufacturing facility to produce NAND flash memory in South Korea, and also upgrade its DRAM production plant in China...
16 by Anton Shilov on 12/23/2016Micron Completes Acquisition of Inotera Memories
Micron this month completed acquisition of Inotera Memories, a DRAM production company it has co-owned for eight years controlled its output for three years. The acquisition is designed to...
1 by Anton Shilov on 12/12/2016Memory Frequency Scaling on Intel's Skull Canyon NUC - An Investigation
Overclocking has generally been the domain of enthusiasts with desktop rigs. However, increasing the CPU frequency beyond the official specification is not the only way to extract more performance...
31 by Ganesh T S on 8/29/2016G.Skill Shows Off Trident Z 8x8 GB and 8x16 DDR4-3333 Memory Kits
When Intel launched its new Core i7 Broadwell-E processors for high-end desktops earlier this year, all leading makers of motherboards released their new breed of Intel X99-based products that...
0 by Anton Shilov on 8/23/2016SK Hynix Adds HBM2 to Catalog: 4 GB Stacks Set to Be Available in Q3
SK Hynix has quietly added its HBM Gen 2 memory stacks to its public product catalog earlier this month, which means that the start of mass production should be...
43 by Anton Shilov on 8/1/2016Patriot Adds Two Dual-Channel DDR4-3733 Memory Kits into Lineup
Patriot this week unveiled two new DDR4 kits rated to run at DDR4-3733. The dual-channel kits are designed for Intel’s latest platforms and belong to Patriot’s Viper Elite and...
12 by Anton Shilov on 7/29/2016Price Check Q3 2016: DRAM Prices Down Over 20% Since Early 2016
Slow sales in the first half of 2016 have negatively affected suppliers of virtually all of PCs, tablets and smartphone components. Producers of DRAM typically suffer more than others...
37 by Anton Shilov on 7/25/2016Corsair Unveils Vengeance LED Modules: DDR4 Gets Lighting, 4333 MT/s Data-Rate
Corsair has introduced its Vengeance LED family of memory modules designed for enthusiasts of high-performance PCs and modders. The fresh range of Corsair’s memory combines new design featuring LED...
18 by Anton Shilov on 6/29/2016Kingston Updates HyperX DDR4 Lineup with DDR4-3000, DDR4-3200 Modules
Following Intel’s announcement of the new Core i7 Broadwell-E lineup of HEDT processors with six, eight and ten cores, Kingston has recently refreshed its HyperX family of DDR4 memory...
8 by Anton Shilov on 6/10/2016Patriot to Release Viper DDR4-2400, DDR4-2800 SO-DIMMs for Laptops
Patriot Memory has introduced its first enthusiast-class DDR4 SO-DIMMs for high-performance-notebooks and small form-factor PCs. The new Patriot Viper modules will combine fairly high clock-rates with decent capacities, thus...
6 by Anton Shilov on 6/2/2016Corsair Announces Dominator Platinum Special Edition and Vengeance LED Memory Modules
In the last 10 years, Corsair has greatly expanded its product lineup and nowadays it produces virtually the whole range of hardware and accessories for enthusiasts with the exception...
16 by Anton Shilov on 6/1/2016Corsair Launches Dominator Platinum Memory Modules for ASUS ROG Systems
Corsair has introduced its new custom-built kit of Dominator Platinum memory modules, which are specifically designed for ASUS ROG motherboards. The new DDR4 modules contain an exclusive SPD profile...
29 by Anton Shilov on 5/27/2016G.Skill Reveals 2x8GB DDR4-4266 C19 and 4x16GB DDR4-3466 C14 Kits
Until recently enthusiasts who would like to use the fastest DDR4 memory with their Skylake-S processors had to use 4 GB DIMMs based on 4 Gb chips, typically sold...
17 by Anton Shilov on 5/20/2016G.Skill Unveils New Trident Z DDR4: Five New Colors
G.Skill has introduced new additions to its Trident Z family of DDR4 memory modules, which are designed to simplify the lives of anyone who wants to color-coordinate their PC...
20 by Anton Shilov on 5/16/2016Samsung Begins To Produce DDR4 Memory Using '10nm Class' Process Tech
Samsung Electronics has started to manufacture DDR4 memory using its new '10nm class' production technology. '10nm class', by definition, implies sub-20nm but without fully disclosing the methodology, similar to...
36 by Anton Shilov on 4/7/2016Price Check: Price Gap Between DDR3 and DDR4 Memory Almost Gone
Around a year ago DRAM manufacturers ended up pinning a lot of their hopes on DDR4 as a way to improve their profit margins. In the cutthroat and highly...
16 by Anton Shilov on 2/25/2016Micron Reports on GDDR5X Dev Progress - Volume Production This Summer
Engineers from Micron Development Center in Munich (also known as Graphics DRAM Design Center) are well known around the industry for their contribution to development of multiple graphics memory...
17 by Anton Shilov on 2/9/2016Corsair and G.Skill Introduce 128 GB (8x16 GB) DDR4-3000 Memory Kits
An average personal computer nowadays is equipped with 8 GB or less of DRAM, according to analysts from DRAMeXchange. Due to the requirements of Microsoft Windows 10 operating system...
10 by Anton Shilov on 1/21/2016JEDEC Publishes HBM2 Specification as Samsung Begins Mass Production of Chips
The high-bandwidth memory (HBM) technology solves two key problems related to modern DRAM: it substantially increases bandwidth available to computing devices (e.g., GPUs) and reduces power consumption. The first-generation...
42 by Anton Shilov on 1/20/2016