TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm with EUV) process technology that uses extreme ultraviolet lithography (EUVL) for up to four layers. The company also said that its clients are on track to tape out chips to be made using N6 node next year. When compared to N7 (1st Generation 7 nm) that solely relies on deep ultraviolet lithography, TSMC lists its N7+ process as providing a 15% to 20% higher transistor density as well as 10% lower power consumption at the same complexity and frequency. Furthermore, after less than two quarters in production, TSMC is stating that N7+ now matches N7’s yields, which has been used for...
Arm and TSMC this week unveiled their jointly developed proof-of-concept chip that combines two quad-core Cortex-72-based 7 nm chiplets on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) interposer. The two chips are connected...26 by Anton Shilov on 9/27/2019
Last week, TSMC made two important announcements concerning its progress with extreme ultraviolet lithography (EUVL). First up, the company has successfully taped out its first customer chip using its...50 by Anton Shilov on 10/9/2018
At a special event last week, TSMC announced the first details about its 5 nm manufacturing technology that it plans to use sometime in 2020. CLN5 will be the...10 by Anton Shilov on 5/8/2018