Honor’s First Gaming Laptop: The Hunter V700

With all the political wrangling going on with Huawei and Honor, one product line that both companies seem to be able to push is the laptop and notebook business...

19 by Dr. Ian Cutress 2 days ago

ADATA XPG Launches a PCIe 4.0 x4 NVMe SSD for Notebooks: Gammix S50 Lite

One of the primary issues with most of the PCIe 4.0 NVMe storage drives on the market today is power consumption. The only base solution for OEMs in the...

13 by Dr. Ian Cutress 2 days ago

Intel’s Tiger Lake 11th Gen Core i7-1185G7 Review and Deep Dive: Baskin’ for the Exotic

The big notebook launch for Intel this year is Tiger Lake, its upcoming 10nm platform designed to pair a new graphics architecture with a nice high frequency for the...

240 by Dr. Ian Cutress & Andrei Frumusanu 4 days ago

The Armari Magnetar X64T Workstation OC Review: 128 Threads at 4.0 GHz, Sustained!

Blitzing around a race track in a fast car only ever convinces you of one thing: I need to go around the track even faster. I need a better...

95 by Dr. Ian Cutress on 9/9/2020

Schenker VIA 14: 14-inch Tiger Lake Magnesium Notebook, with 28W Version Inbound

With Intel lifting the lid on its new Tiger Lake mobile processors today, a number of vendors are announcing their upcoming notebooks. Schenker Technologies, a German brand known in...

35 by Dr. Ian Cutress on 9/2/2020

Intel Launches 11th Gen Core Tiger Lake: Up to 4.8 GHz at 50 W, 2x GPU with Xe, New Branding

In August, Intel ran one of its rare Architecture Days where the company went into some detail about its upcoming Tiger Lake processor. This included target markets, core counts...

350 by Dr. Ian Cutress on 9/2/2020

Intel Launches Tiger Lake: A Live Blog (Noon ET, 9am PT)

Intel is about to launch Tiger Lake. Follow along with our Live Blog!

58 by Dr. Ian Cutress on 9/2/2020

3DFabric: The Home for TSMC’s 2.5D and 3D Stacking Roadmap

Interposers. EMIB. Foveros. Die-to-die stacking. ODI. AIB.TSVs. All these words and acronyms have one overriding feature – they are all involved in how two bits of silicon physically connect...

12 by Dr. Ian Cutress on 9/2/2020

TeamGroup Previews New 15.36 TB Consumer SATA SSD, for $3990

The two main angles that most SSD storage seems to be moving towards is performance or capacity. On the capacity front, we are starting to see the first 8...

26 by Dr. Ian Cutress on 9/2/2020

Best CPUs for Gaming: August 2020

Sometimes choosing a CPU is hard. So we've got you covered. In our CPU Guides, we give you our pick of some of the best processors available, supplying data...

22 by Dr. Ian Cutress on 8/31/2020

TSMC Launches New N12e Process: FinFET at 0.4V for IoT

One of the main drivers for the semiconductor industry is the growth in always-connected devices that require silicon inside, either for compute, communication, or control. The ‘Internet of Things&rsquo...

27 by Dr. Ian Cutress on 8/27/2020

TSMC: We have 50% of All EUV Installations, 60% Wafer Capacity

One of the overriding central messages to TSMC’s Technology Symposium this week is that the company is a world leader in semiconductor manufacturing, especially at the leading edge process...

34 by Dr. Ian Cutress on 8/27/2020

TSMC and Graphcore Prepare for AI Acceleration on 3nm

One of the side announcements made during TSMC’s Technology Symposium was that it already has customers on hand with product development progressing for its future 3nm process node technology...

2 by Dr. Ian Cutress on 8/27/2020

Where are my GAA-FETs? TSMC to Stay with FinFET for 3nm

As we passed that 22nm to 16nm barrier, almost all the major semiconductor fabrication companies on the leading edge transitioned from planar transistors to FinFET transistors. The benefits of...

36 by Dr. Ian Cutress on 8/26/2020

Nimbus Data’s New ExaDrive NL: 64 TB of Enterprise Grade QLC in 3.5-inch

Today Nimbus Data, one of the first companies to venture into enterprise flash storage in 2003, is announcing its latest generation ExaDrive product. Following on from the success of...

27 by Dr. Ian Cutress on 8/26/2020

NVIDIA Confirms 12-pin GPU Power Connector

Today as part of a video showcasing NVIDIA’s mechanical and industrial design of its GPUs, and how it gets a large GPU to dissipate heat, the company went into...

80 by Dr. Ian Cutress on 8/26/2020

TSMC Expects 5nm to be 11% of 2020 Wafer Production (sub 16nm)

One of the measures of how quickly a new process node gains traction is by comparing how many wafers are in production, especially as that new process node goes...

12 by Dr. Ian Cutress on 8/25/2020

TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme

I’ve maintained for a couple of years now that the future battleground when it comes to next-generation silicon is going to be in the interconnect – implicitly this relies...

16 by Dr. Ian Cutress on 8/25/2020

TSMC Updates on Node Availability Beyond Logic: Analog, HV, Sensors, RF

Most of the time when we speak about semiconductor processes, we are focused on the leading edge of what is possible. Almost exclusively that leading edge is designed for...

2 by Dr. Ian Cutress on 8/25/2020

‘Better Yield on 5nm than 7nm’: TSMC Update on Defect Rates for N5

One of the key metrics on how well a semiconductor process is developing is looking at its quantitative chip yield – or rather, its defect density. A manufacturing process...

107 by Dr. Ian Cutress on 8/25/2020

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