SK Hynix

As the 2022 Flash Memory Summit continues, SK hynix is the latest vendor to announce their next generation of NAND flash memory at the show. Showcasing for the first time the company’s forthcoming 238 layer TLC NAND, which promises both improved density/capacity and improved bandwidth. At 238 layers, SK hynix has, at least for the moment, secured bragging rights for the greatest number of layers in a TLC NAND die – though with mass production not set to begin until 2023, it’s going to be a while until the company’s newest NAND shows up in retail products. Following closely on the heels of Micron’s 232L TLC NAND announcement last week, SK hynix is upping the ante ever so slightly with a 238 layer design. Though...

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