SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by Invensas. The latter was designed to enable building up to 16-Hi chip assemblies, including next-generation memory, and highly-integrated SoCs that feature numerous homogeneous layers. Invensas’ DBI Ultra is a proprietary die-to-wafer hybrid bonding interconnect technology that supports from 100,000 to 1,000,000 interconnects per mm2, using interconnect pitches as small as 1 µm. According to the company, the much greater number of interconnects can offer dramatically increased bandwidth vs. conventional copper pillar interconnect technology, which only goes as high as 625 interconnects per mm2. The small interconnects also offer a shorter z-height, making it possible to build...
Nintendo Announces the New Nintendo 3DS and 3DS LL
Earlier today Nintendo announced an updated version of its Nintendo 3DS handheld gaming console. It's been over 3 years since the launch of the original 3DS, and with Nintendo...25 by Brandon Chester on 8/29/2014
Indie Platformer VVVVVV to Appear on Nintendo 3DS
Terry Cavanagh’s gravity-bending platformer VVVVVV will be coming to Nintendo’s 3D handheld, thanks to a recent publishing deal with Nicalis. VVVVVV was released last September and quickly garnered attention...7 by Craig Getting on 10/7/2011
Nintendo 3DS Gets $80 Price Cut on August 12
Those of you on the fence about Nintendo's 3DS, your wait may soon be over: Starting August 12, the price of the system will fall from its current $249.99...10 by Andrew Cunningham on 7/28/2011